Multiple products from business enterprises in Hailing Industrial Park — located in Taizhou city in East China's Jiangsu province — have been recognized provincially.
They've been included in a Jiangsu provincial certified list focusing on new technologies and products, with Taizhou securing 248 approved entries overall.
Jiangsu Zhongke Kehua New Materials Co, or Scienchem, gained recognition for its MUF-type epoxy molding compound for flip-chip packaging as a "first-batch new material".
Meanwhile, Jiangsu Yunyong Electronics and Technology, earned a "first-edition software product" designation for its self-developed Smart Archives Repository Integrated Management Platform V3.
Scienchem's epoxy molding compound reportedly achieves high-flow filling and low-stress encapsulation through an independent formula design, significantly enhancing filling efficiency and reliability for micro-gaps in flip-chip packaging.
With low thermal expansion, high thermal conductivity and tolerance for 260 C lead-free reflow soldering, it is said to allow domestic substitution for high-end chip packaging.
Elsewhere, Yunyong Electronics and Technology's Platform V3 leverages internet of thing technology to integrate radio frequency identification with smart compact shelving and repository management equipment.
It combines archival management, device control and storage monitoring into a unified system — enabling full-process, omni-directional management while substantially elevating intelligent archival oversight.
Work gets underway at the factory run by Jiangsu Zhongke Kehua New Materials Co in Hailing Industrial Park. [Photo/WeChat account: gh_4df9b5f9b40b]
An aerial view of Jiangsu Yunyong Electronics and Technology Co in Hailing Industrial Park. [Photo/WeChat account: gh_4df9b5f9b40b]