Jiangsu Zhongke Kehua New Materials has secured first prize in the enterprise category at the 11th Jiangsu SME Innovation and Entrepreneurship Competition. It was the sole enterprise from Taizhou to win a first-place award among 450 competing entries.
The company earned the honor for its project, "Research on Manufacturing Technology of Granular EMC for Compression Molding". Developed to meet the rigorous packaging requirements of high-performance computing chips, 3D advanced packaging, and high-bandwidth memory (HBM), the proprietary granular epoxy molding compound (EMC) offers rapid curing, low stress, low warpage, and high reliability.
Evaluated as internationally advanced, the breakthrough fills a critical domestic gap in high-end granular EMC materials.
Originating from the Institute of Chemistry, Chinese Academy of Sciences, and based in Hailing Industrial Park, Zhongke Kehua is a national-level "little giant" enterprise. Equipped with eight production lines and an annual capacity exceeding 18,000 metric tons, the company continues to drive localization in advanced semiconductor materials.